Summary
This company specializes in developing advanced assembly processes and equipment for various packaging applications, including leadframe, substrate, and wafer level packaging. It serves a diverse range of end-user markets such as electronics, mobile internet, cloud servers, computing, automotive, industrial, LED, and solar energy. The business focuses on innovation in semiconductor equipment and offers a variety of products and services, including die attach, packaging, plating, and cleaning solutions.
Based on content on besi.com
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Label
Value
Active Dates
28.1 years — Since Dec 1996
Web Hosting
Platform
E-Mail Provider
NAICS Code
333242
SIC 4 Digit Code
3674
SIC 2 Digit Code
36
Industry
1. Semiconductor Equipment Manufacturing
2. Semiconductor Machinery Manufacturing
Vendor
Source
Apple
TXT Record
Atlassian
TXT Record
Cisco CI
TXT Record
Smartsheet
TXT Record
Year | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec |
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1996 |
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1997 |
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1998 |
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1999 |
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2000 |
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2001 |
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2002 |
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2003 |
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2004 |
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2005 |
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2006 |
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2007 |
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2008 |
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2009 |
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2010 |
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2011 |
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2012 |
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2013 |
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2014 |
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2015 |
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2016 |
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2017 |
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2018 |
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2019 |
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2020 |
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2021 |
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2022 |
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2023 |
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2024 |
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