Summary
This company specializes in developing advanced assembly processes and equipment for various packaging applications, including leadframe, substrate, and wafer level packaging. It serves a diverse range of end-user markets such as electronics, mobile internet, cloud servers, computing, automotive, industrial, LED, and solar energy. The business focuses on innovation in semiconductor equipment and offers a variety of products and services, including die attach, packaging, plating, and cleaning solutions.
Based on content on besi.com
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