Summary
This company specializes in developing advanced assembly processes and equipment for various packaging applications, including leadframe, substrate, and wafer level packaging. It serves a diverse range of end-user markets such as electronics, mobile internet, cloud servers, computing, automotive, industrial, LED, and solar energy. The business focuses on innovation in semiconductor equipment and offers a variety of products and services, including die attach, packaging, plating, and cleaning solutions.
Subdomain
Target
81.223.142.135 -
confluence-besiazure.msappproxy.net
donglegeneratorfrontend.azurewebsites.net
212.31.79.212 -
212.31.79.213 -
128.204.136.22 -
formapprovalfrontend.azurewebsites.net
jira-besiazure.msappproxy.net
jira-test-besiazure.msappproxy.net
materialadjustmenttools.besi.com
materialadjustmenttoolsfrontend.azurewebsites.net
212.166.117.187 -
212.31.79.211 -
productionordertracking.besi.com
productionordertrackingfrontend.azurewebsites.net
119.75.23.210 -
212.166.116.186 -
212.31.79.214 -
212.31.79.214 -
besists.trafficmanager.net
gentle-beach-03d768d03.4.azurestaticapps.net
212.31.79.210 -
212.31.79.210 -
212.31.79.208 -
timeabsencemanagement.besi.com
timeabsencemanagementfrontend.azurewebsites.net
212.31.79.209 -
185.71.62.126 -
78.46.2.132 -